Power Control PCB

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  • Capability

  • Power Control PCB Capabilities

ltem Capability
Material FR-4 Standard Tg 140°C, FR4-High Tg 170°C
Min. Track/Spacing For External layers:
4oz Cu 10mil/13mil, 5oz Cu 12mil/15mil, 6oz Cu 15mil/15mil

For Internal layers:
4oz Cu 8mil/8mil, 5oz Cu 10mil/10mil, 6oz Cu 12mil/12mil
Min. Hole Size 0.15 ~ 0.3mm
Max Outer Layer Copper Weight (Finished) 12oz
Max Inner Layer Copper Weight 12oz
Board Thickness 0.6-6mm
Surface Finishing HASL lead-free, Immersion gold, OSP, Hard Gold, Immersion Silver, Enepig
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
Silkscreen White, Black
Via Process Tenting Vias, Plugged Vias, Vias not covered
Testing Fly Probe Testing (Free) and A.O.I. testing
Build time 5-15 days
Lead time 2-3 days

equitment equitment

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