Efficient Use of Space – BGA PCB layout allows us to efficiently use the available space, so we can mount more components and manufacture lighter devices.
Better Thermal Performance – For BGA, the heat generated by the components is transferred directly through the ball. In addition, the large contact area improves heat dissipation, which prevents overheating of components and ensures long life.
Higher Electrical Conductivity – The path between the die and the circuit board is short, which results in better electrical conductivity. Moreover, there is no through-hole on the board, the whole circuit board is covered with solder balls and other components, so vacant spaces are reduced.
Easy to Assemble And Manage – Compared to other PCB assembly techniques, BGA is easier to assemble and manage as the solder balls are used directly to solder the package to the board.
Less Damage to Leads – We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during the operation.